Electronic device comprising antenna for wireless communication

ABSTRACT

An electronic device is provided. The electronic device includes a front plate disposed on a display, a back plate disposed on a back surface of the electronic device, a side member placed between the front plate and the back plate and forming an outer appearance of the electronic device together with the front plate and the back plate, and first, second, and third antenna modules including a plurality of conductive plates configured to transmit/receive a signal in a specified first frequency band and disposed between the front plate and the back plate so as to be adjacent to the side member. At least a portion of the side member is able to be used as an antenna of a signal in a specified second frequency band different from the specified first frequency band.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is based on and claims priority under 35 U.S.C. §119(a) of a Korean patent application number 10-2018-0156404, filed onDec. 6, 2018, in the Korean Intellectual Property Office, the disclosureof which is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to an electronic device including an antenna forwireless communication.

2. Description of Related Art

As mobile communication technologies develop, an electronic device,which is equipped with an antenna, such as a smartphone, a wearabledevice, or the like is being widely supplied. The electronic device mayreceive or transmit a signal including data (e.g., a message, a photo, avideo, a music file, a game, and the like) through the antenna. In theelectronic device, a signal that is received by using the antenna isprovided to a radio frequency integrated circuit (RFIC).

The antenna of the electronic device is implemented by using a pluralityof antenna elements for the purpose of receiving or transmitting asignal more efficiently. For example, the electronic device may includeone or more antenna arrays, in each of which a plurality of antennaelements are arranged in a regular shape. The antenna array has aneffective isotropically radiated power (EIRP) greater than one antennaelement. As such, the electronic device that includes the antenna arraymay receive or transmit a signal efficiently.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

To improve the throughput, 5^(th) generation (5G) mobile communicationmay use a wireless signal in a relatively high frequency band comparedto 4^(th) generation (4G) mobile communication. Because a physicalcharacteristic of an antenna varies depending on a frequency of asignal, different antennas may be used depending on frequency bands tobe used. For example, an electronic device may use different antennaswith respect to a signal having a center frequency less thanapproximately 6 GHz and a signal having a center frequency ofapproximately 6 GHz or higher. In the case of the signal having thecenter frequency of approximately 6 GHz or higher, the electronic devicemay transmit/receive a wireless signal by using an antenna module inwhich a portion of a radio frequency (RF) circuit is integrated with anantenna.

To receive a high frequency signal (e.g., a signal having a centerfrequency of approximately 6 GHz or higher), a plurality of antennamodules may be disposed at the electronic device such that the receivecoverage of the electronic device covers all directions (i.e.,omnidirection) of the electronic device. Due to the miniaturization andmulti-function of the electronic device, the electronic device may havea limited mounting space. Accordingly, the number of antenna modulescapable of being mounted at the electronic device may also be limited.

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providean electronic device having an optimized coverage.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, an electronic device isprovided. The electronic device includes a display disposed on a frontsurface of the electronic device and a front plate disposed on thedisplay, a back plate that is disposed on a back surface of theelectronic device, a side member that is placed between the front plateand the back plate and forms an outer appearance of the electronicdevice together with the front plate and the back plate, a first antennamodule that includes a plurality of first patch antenna elements and aplurality of first dipole antenna elements configured totransmit/receive a signal in a first frequency band and is placedadjacent to the side member and on an upper portion of the electronicdevice such that the plurality of first patch antenna elements face theback plate, a second antenna module that includes a plurality of secondpatch antenna elements configured to transmit/receive the signal in thefirst frequency band and is placed adjacent to the side member such thatthe plurality of second patch antenna elements face a left side of theelectronic device when viewing the electronic device from the backsurface, and a third antenna module that includes a plurality of thirdpatch antenna elements configured to transmit/receive the signal in thefirst frequency band and is placed adjacent to the side member such thatthe plurality of third patch antenna elements face a right side of theelectronic device when viewing the electronic device from the backsurface.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a display disposed ona front surface of the electronic device and a front plate disposed onthe display, a back plate that is disposed on a back surface of theelectronic device, a side member that is placed between the front plateand the back plate and forms an outer appearance of the electronicdevice together with the front plate and the back plate, a first antennamodule that includes a plurality of first patch antenna elements and aplurality of first dipole antenna elements configured totransmit/receive a signal in a first frequency band and is placedadjacent to a speaker placed on an upper middle of the electronic devicewhen viewed from the back surface of the electronic device, a secondantenna module that includes a plurality of second patch antennaelements configured to transmit/receive the signal in the firstfrequency band and is placed adjacent to the side member and on an upperleft of the electronic device when viewed from the back surface of theelectronic device, and a third antenna module that includes a pluralityof third patch antenna elements configured to transmit/receive thesignal in the first frequency band and is placed on a lower right of theelectronic device and between a battery and the side member when viewingthe electronic device from the back surface, the plurality of secondpatch antenna elements may be disposed to transmit/receive a wirelesssignal toward a left side of the electronic device when viewing theelectronic device from the back surface, and the plurality of thirdpatch antenna elements may be disposed to transmit/receive a wirelesssignal toward a right side of the electronic device when viewing theelectronic device from the back surface.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram illustrating an electronic device in a networkenvironment according to an embodiment of the disclosure;

FIG. 2 is a front perspective view of a mobile electronic deviceaccording to an embodiment of the disclosure;

FIG. 3 is a rear perspective view of an electronic device of FIG. 2according to an embodiment of the disclosure;

FIG. 4 is an exploded perspective view of an electronic device of FIG. 2according to an embodiment of the disclosure;

FIG. 5 is a block diagram of an electronic device in a networkenvironment including a plurality of cellular networks, according to anembodiment of the disclosure;

FIG. 6 illustrates a block diagram of an antenna module according to anembodiment of the disclosure;

FIG. 7 is a front perspective view of an antenna module according to anembodiment of the disclosure;

FIG. 8 is a perspective view of an antenna module according to anembodiment of the disclosure;

FIG. 9A is a perspective view of an antenna module according to anembodiment of the disclosure;

FIG. 9B is a perspective view of an antenna module according to anembodiment of the disclosure;

FIG. 10 is a view illustrating antenna modules disposed in an electronicdevice, according to an embodiment of the disclosure;

FIG. 11 is a cross-sectional view of an electronic device according toan embodiment of the disclosure;

FIG. 12 is a cross-sectional view of an electronic device according toan embodiment of the disclosure;

FIG. 13 is a view illustrating antenna modules disposed in an electronicdevice, according to an embodiment of the disclosure;

FIG. 14 is a cross-sectional view of an interior of an electronic deviceaccording to an embodiment of the disclosure;

FIG. 15 is a cross-sectional view of an interior of an electronic deviceaccording to an embodiment of the disclosure;

FIG. 16 is a view illustrating antenna modules disposed in an electronicdevice, according to an embodiment of the disclosure; and

FIG. 17 is a cross-sectional view of an electronic device according toan embodiment of the disclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purpose only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 1 is a block diagram illustrating an electronic device in a networkenvironment according to an embodiment of the disclosure.

Referring to FIG. 1, an electronic device 101 in a network environment100 may communicate with an electronic device 102 via a first network198 (e.g., a short-range wireless communication network), or anelectronic device 104 or a server 108 via a second network 199 (e.g., along-range wireless communication network). According to an embodiment,the electronic device 101 may communicate with the electronic device 104via the server 108. According to an embodiment, the electronic device101 may include a processor 120, memory 130, an input device 150, asound output device 155, a display device 160, an audio module 170, asensor module 176, an interface 177, a haptic module 179, a cameramodule 180, a power management module 188, a battery 189, acommunication module 190, a subscriber identification module (SIM) 196,or an antenna module 197. In some embodiments, at least one (e.g., thedisplay device 160 or the camera module 180) of the components may beomitted from the electronic device 101, or one or more other componentsmay be added in the electronic device 101. In some embodiments, some ofthe components may be implemented as single integrated circuitry. Forexample, the sensor module 176 (e.g., a fingerprint sensor, an irissensor, or an illuminance sensor) may be implemented as embedded in thedisplay device 160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to one embodiment, as at least part of the data processing orcomputation, the processor 120 may load a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), and an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), an image signal processor (ISP), asensor hub processor, or a communication processor (CP)) that isoperable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor 123 may beadapted to consume less power than the main processor 121, or to bespecific to a specified function. The auxiliary processor 123 may beimplemented as separate from, or as part of the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display device 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 123 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input device 150 may receive a command or data to be used by othercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputdevice 150 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 155 may output sound signals to the outside ofthe electronic device 101. The sound output device 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for an incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display device 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display device 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaydevice 160 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input device 150, or output the sound via the soundoutput device 155 or a headphone of an external electronic device (e.g.,an electronic device 102) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andgenerate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 177 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, anHDMI connector, a USB connector, a SD card connector, or an audioconnector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to one embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as Bluetooth™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a cellular network, the Internet, or a computer network (e.g.,LAN or wide area network (WAN)). These various types of communicationmodules may be implemented as a single component (e.g., a single chip),or may be implemented as multi components (e.g., multi chips) separatefrom each other. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas. In such a case,at least one antenna appropriate for a communication scheme used in thecommunication network, such as the first network 198 or the secondnetwork 199, may be selected, for example, by the communication module190 (e.g., the wireless communication module 192) from the plurality ofantennas. The signal or the power may be transmitted or received betweenthe communication module 190 and the external electronic device via theselected at least one antenna. According to an embodiment, anothercomponent (e.g., a radio frequency integrated circuit (RFIC)) other thanthe radiating element may be additionally formed as part of the antennamodule 197.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 and 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, or client-server computingtechnology may be used, for example.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude any one of, or all possible combinations of the items enumeratedtogether in a corresponding one of the phrases. As used herein, suchterms as “1st” and “2nd,” or “first” and “second” may be used to simplydistinguish a corresponding component from another, and does not limitthe components in other aspect (e.g., importance or order). It is to beunderstood that if an element (e.g., a first element) is referred to,with or without the term “operatively” or “communicatively”, as “coupledwith,” “coupled to,” “connected with,” or “connected to” another element(e.g., a second element), it means that the element may be coupled withthe other element directly (e.g., wiredly), wirelessly, or via a thirdelement.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, and may interchangeably be used withother terms, for example, “logic,” “logic block,” “part,” or“circuitry”. A module may be a single integral component, or a minimumunit or part thereof, adapted to perform one or more functions. Forexample, according to an embodiment, the module may be implemented in aform of an application-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a compiler or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the term “non-transitory” simply means that the storage medium is atangible device, and does not include a signal (e.g., an electromagneticwave), but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities. According to various embodiments, one or more ofthe above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to various embodiments, operations performedby the module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

FIG. 2 is a front perspective view of a mobile electronic deviceaccording to an embodiment of the disclosure.

FIG. 3 is a rear perspective view of an electronic device of FIG. 2according to an embodiment of the disclosure.

Referring to FIGS. 2 and 3, an electronic device 200 (e.g., theelectronic device 101 of FIG. 1) according to an embodiment may includea housing 210 that includes a first surface (or a front surface) 210A, asecond surface (or a back surface) 210B, and a side surface 210Csurrounding a space between the first surface 210A and the secondsurface 210B. In another embodiment (not illustrated), a housing mayrefer to a structure that forms a portion of the first surface 210A, thesecond surface 210B, and the side surface 210C of FIG. 2. According toan embodiment, the first surface 210A may be formed by a front plate 202(e.g., a glass plate including various coating layers, or a polymerplate), of which at least a portion is substantially transparent. Thesecond surface 210B may be formed by a back plate 211 that issubstantially opaque. For example, the back plate 211 may be formed by acoated or colored glass, a ceramic, a polymer, a metal (e.g., aluminum,stainless steel (STS), or magnesium), or a combination of at least twoof the materials. The side surface 210C may be coupled to the frontplate 202 or the back plate 211 and may be formed by a side bezelstructure (or a “side member”) 218 including a metal and/or a polymer.In an embodiment, the back plate 211 and the side bezel structure 218may be integrally formed and may include the same material (e.g., ametal material such as aluminum).

In the embodiment that is illustrated, the front plate 202 may includetwo first regions 210D, which are bent toward the back plate 211 fromthe first surface 210A so as to be seamlessly extended, at opposite longedges of the front plate 202. In the embodiment (refer to FIG. 3) thatis illustrated, the back plate 211 may include two second regions 210E,which are bent toward the front plate 202 from the second surface 210Bso as to be seamlessly extended, at opposite long edges thereof. In anembodiment, the front plate 202 (or the back plate 211) may include onlyone of the first regions 210D (or the second regions 210E). In anotherembodiment, a portion of the first regions 210D or the second regions210E may not be included. In the embodiments, when viewed from a sidesurface of the electronic device 200, the side bezel structure 218 mayhave a first thickness (or width) on one side where the first regions210D or the second regions 210E are not included, and may have a secondthickness, which is smaller than the first thickness, on one side wherethe first regions 210D or the second regions 210E are included.

According to an embodiment, the electronic device 200 may include atleast one or more of a display 201, an audio module (203, 207, 214), asensor module (204, 216, 219), a camera module (205, 212, 213), keyinput devices 217, a light-emitting device 206, and a connector hole(208, 209). In an embodiment, the electronic device 200 may not includeat least one (e.g., the key input devices 217 or the light-emittingdevice 206) of the components or may further include any othercomponent.

The display 201 may be exposed through a considerable portion of thefront plate 202, for example. In an embodiment, at least a portion ofthe display 201 may be exposed through the first surface 210A, and thefront plate 202 forming the first regions 210D of the side surface 210C.In an embodiment, a corner of the display 201 may be formed to be mostlyidentical to a shape of an outer portion of the front plate 202 adjacentthereto. In another embodiment (not illustrated), to increase the areawhere the display 201 is exposed, a difference between the outer portionof the display 201 and an outer portion of the front plate 202 may beformed mostly identically.

In another embodiment (not illustrated), a recess or an opening may beformed at a portion of a screen display region of the display 201, andat least one or more of the audio module 214, the sensor module 204, thecamera module 205, and the light-emitting device 206 may be provided tobe aligned with the recess or the opening. In another embodiment (notillustrated), at least one or more of the audio module 214, the sensormodule 204, the camera module 205, the fingerprint sensor 216, and thelight-emitting device 206 may be provided on a back surface of thedisplay 201, which corresponds to the screen display region. In anotherembodiment (not illustrated), the display 201 may be coupled to a touchsensing circuit, a pressure sensor capable of measuring the intensity(or pressure) of a touch, and/or a digitizer capable of detecting amagnetic stylus pen or may be disposed adjacent thereto. In anembodiment, at least a portion of the sensor module (204, 219) and/or atleast a portion of the key input devices 217 may be disposed in thefirst regions 210D and/or the second regions 210E.

The audio module (203, 207, 214) may include the microphone hole 203 andthe speaker hole (207, 214). A microphone for obtaining external soundmay be disposed within the microphone hole 203. In an embodiment, aplurality of microphones may be disposed to detect a direction of sound.The speaker hole (207, 214) may include the external speaker hole 207and the receiver hole 214 for call. In an embodiment, the speaker hole(207, 214) and the microphone hole 203 may be implemented with one hole,or a speaker (e.g., a piezo speaker) may be included without the speakerhole (207, 214).

The sensor module (204, 216, 219) may generate an electrical signal or adata value that corresponds to an internal operation state of theelectronic device 200 or corresponds to an external environment state.The sensor module (204, 216, 219) may include, for example, the firstsensor module 204 (e.g., a proximity sensor) and/or a second sensormodule (not illustrated) (e.g., a fingerprint sensor) disposed on thefirst surface 210A of the housing 210, and/or the third sensor module219 (e.g., a hear rate monitor (HRM) sensor) and/or the fourth sensormodule 216 (e.g., a fingerprint sensor) disposed on the second surface210B of the housing 210. The fingerprint sensor may be disposed on thesecond surface 210B as well as the first surface 210A (e.g., a home keybutton, not shown) of the housing 210. The electronic device 200 mayfurther include a sensor module not illustrated, for example, at leastone of a gesture sensor, a gyro sensor, a barometric pressure sensor, amagnetic sensor, an acceleration sensor, a grip sensor, a color sensor,an infrared (IR) sensor, a biometric sensor, a temperature sensor, ahumidity sensor, or an illumination sensor 204.

The camera module (205, 212, 213) may include the first camera device205 disposed on the first surface 210A of the electronic device 200, andthe second camera device 212 and/or the flash 213 disposed on the secondsurface 210B. The camera devices 205 and 212 may include one or morelenses, an image sensor, and/or an image signal processor. The flash 213may include, for example, a light-emitting diode or a xenon lamp. In anembodiment, two or more lenses (e.g., an infrared camera and wide-angleand telephoto lenses) and image sensors may be disposed on one surfaceof the electronic device 200.

The key input devices 217 may be disposed on the side surface 210C ofthe housing 210. In another embodiment, the electronic device 200 maynot include all or a part of the key input devices 217, and a key inputdevice not included may be implemented on the display 201 in the form ofa soft key. In an embodiment, a key input device may include the sensormodule 216 disposed on the second surface 210B of the housing 210.

The light-emitting device 206 may be disposed, for example, on the firstsurface 210A of the housing 210. The light-emitting device 206 mayprovide status information of the electronic device 200, for example, inthe form of light. In another embodiment, the light-emitting device 206may provide, for example, a light source that operates in conjunctionwith an operation of the camera module 205. The light-emitting device206 may include, for example, a light-emitting diode (LED), an IR LED,and a xenon lamp.

The connector hole (208, 209) may include the first connector hole 208that is able to accommodate a connector (e.g., a USB connector) fortransmitting/receiving a power and/or data with an external electronicdevice, and/or the second connector hole (or an earphone jack) 209 thatis able to accommodate a connector for transmitting/receiving an audiosignal with the external electronic device.

FIG. 4 is an exploded perspective view of an electronic device of FIG. 2according to an embodiment of the disclosure.

Referring to FIG. 4, an electronic device 400 may include a side bezelstructure 410, a first support member 411 (e.g., a bracket), a frontplate 420, a display 430, a printed circuit board 440, a battery 450, asecond support member 460 (e.g., a rear case), an antenna 470, and aback plate 480. In an embodiment, the electronic device 400 may notinclude at least one (e.g., the first support member 411 or the secondsupport member 460) of the components or may further include any othercomponent. At least one of the components of the electronic device 400may be identical or similar to at least one of the components of theelectronic device 200 of FIG. 2 or 3, and thus, additional descriptionwill be omitted to avoid redundancy.

The first support member 411 may disposed within the electronic device400 so as to be connected with the side bezel structure 410 or may beintegrally formed with the side bezel structure 410. The first supportmember 411 may be formed of, for example, a metal material and/or anonmetal material (e.g., polymer). The display 430 may be coupled to onesurface of the first support member 411, and the printed circuit board440 may be coupled to an opposite surface of the first support member411. A processor, a memory, and/or an interface may be mounted on theprinted circuit board 440. For example, the processor may include one ormore of a central processing unit, an application processor, a graphicprocessing device, an image signal processor, a sensor hub processor, ora communication processor.

The memory may include, for example, a volatile memory or a nonvolatilememory.

The interface may include, for example, an HDMI, a USB interface, an SDcard interface, and/or an audio interface. The interface mayelectrically or physically connect, for example, the electronic device400 with an external electronic device and may include a USB connector,an SD card/MMC connector, or an audio connector.

The battery 450 is a device for supplying a power to at least onecomponent of the electronic device 400 and may include, for example, aprimary cell incapable of being recharged, a secondary cell capable ofbeing recharged, or a fuel cell. At least a portion of the battery 450may be disposed on substantially the same plane as the printed circuitboard 440, for example. The battery 450 may be integrally disposedwithin the electronic device 400, or may be disposed to be removablefrom the electronic device 400.

The antenna 470 may be disposed between the back plate 480 and thebattery 450. The antenna 470 may include, for example, a near fieldcommunication (NFC) antenna, an antenna for wireless charging, and/or amagnetic secure transmission (MST) antenna. For example, the antenna 470may perform short range communication with an external device or maywirelessly transmit/receive a power necessary to charge. In anotherembodiment, an antenna structure may be formed by a portion of the sidebezel structure 410 and/or the first support member 411, or by acombination thereof.

FIG. 5 is a block diagram of an electronic device in a networkenvironment including a plurality of cellular networks, according to anembodiment of the disclosure.

Referring to FIG. 5, the electronic device 101 may include a firstcommunication processor 512, a second communication processor 514, afirst radio frequency integrated circuit (RFIC) 522, a second RFIC 524,a third RFIC 526, a fourth RFIC 528, a first radio frequency front end(RFFE) 532, a second RFFE 534, a first antenna module 542, a secondantenna module 544, and an antenna 548. The electronic device 101 mayfurther include the processor 120 and the memory 130. The second network199 may include a first cellular network 592 and a second cellularnetwork 594. For example, the first cellular network 592 and the secondcellular network 594 may be physically distinguished. For anotherexample, the first cellular network 592 and the second cellular network594 may be logically distinguished. According to another embodiment, theelectronic device 101 may further include at least one component of thecomponents illustrated in FIG. 1, and the second network 199 may furtherinclude at least another network. According to an embodiment, the firstcommunication processor 512, the second communication processor 514, thefirst RFIC 522, the second RFIC 524, the fourth RFIC 528, the first RFFE532, and the second RFFE 534 may form at least a portion of the wirelesscommunication module 192. According to another embodiment, the fourthRFIC 528 may be omitted or may be included as a portion of the thirdRFIC 526.

The first communication processor 512 may establish a communicationchannel for a band to be used for wireless communication with the firstcellular network 592 and may support legacy network communicationthrough the established communication channel. According to variousembodiments, the first cellular network 592 may be a legacy networkincluding a 2^(nd) generation (2G), a 3^(rd) generation (3G), a 4G, or along term evolution (LTE) network. The second communication processor514 may establish a communication channel corresponding to a specifiedband (e.g., ranging from approximately 6 GHz to approximately 60 GHz) ofbands to be used for wireless communication with the second cellularnetwork 594 and may support 5G network communication through theestablished communication channel. According to various embodiments, thesecond cellular network 594 may be a 5G network defined in the 3rdgeneration partnership project (3GPP). Additionally, according to anembodiment, the first communication processor 512 or the secondcommunication processor 514 may establish a communication channelcorresponding to another specified band (e.g., approximately 6 GHz orlower) of the bands to be used for wireless communication with thesecond cellular network 594 and may support 5G network communicationthrough the established communication channel. According to anembodiment, the first communication processor 512 and the secondcommunication processor 514 may be implemented in a single chip or asingle package. According to various embodiments, the firstcommunication processor 512 or the second communication processor 514may be implemented in a single chip or a single package together withthe processor 120, the auxiliary processor 123, or the communicationmodule 190. According to an embodiment, the first communicationprocessor 512 and the second communication processor 514 may be directlyor indirectly connected by an interface (not illustrated) and mayprovide or receive data or a control signal in one direction or inopposite directions.

In the case of transmitting a signal, the first RFIC 522 may convert abaseband signal generated by the first communication processor 512 intoa radio frequency (RF) signal of approximately 700 MHz to approximately3 GHz that is used in the first cellular network 592 (e.g., a legacynetwork). In the case of receiving a signal, an RF signal may beobtained from the first cellular network 592 (e.g., a legacy network)through an antenna (e.g., the first antenna module 542) and may bepreprocessed through an RFFE (e.g., the first RFFE 532). The first RFIC522 may convert the preprocessed RF signal into a baseband signal so asto be processed by the first communication processor 512.

In the case of transmitting a signal, the second RFIC 524 may convert abaseband signal generated by the first communication processor 512 orthe second communication processor 514 into an RF signal (hereinafterreferred to as a “5G Sub6 RF signal”) in a Sub6 band (e.g.,approximately 6 GHz or lower). In the case of receiving a signal, the 5GSub6 RF signal may be obtained from the second cellular network 594(e.g., a 5G network) through an antenna (e.g., the second antenna module544) and may be preprocessed through an RFFE (e.g., the second RFFE534). The second RFIC 524 may convert the preprocessed 5G Sub6 RF signalinto a baseband signal so as to be processed by a communicationprocessor corresponding to the 5G Sub6 RF signal from among the firstcommunication processor 512 or the second communication processor 514.

The third RFIC 526 may convert a baseband signal generated by the secondcommunication processor 514 into an RF signal (hereinafter referred toas a “5G Above6 RF signal”) in a 5G Above6 band (e.g., approximately 6GHz to approximately 60 GHz) to be used in the second cellular network594 (e.g., a 5G network). In the case of receiving a signal, the 5GAbove6 RF signal may be obtained from the second cellular network 594(e.g., a 5G network) through an antenna (e.g., the antenna 548) and maybe preprocessed through a third RFFE 536. The third RFIC 526 may convertthe preprocessed 5G Above6 RF signal into a baseband signal so as to beprocessed by the second communication processor 514. According to anembodiment, the third RFFE 536 may be implemented as a portion of thethird RFIC 526.

According to an embodiment, the electronic device 101 may include thefourth RFIC 528 independently of the third RFIC 526 or as at least aportion of the third RFIC 526. In this case, the fourth RFIC 528 mayconvert a baseband signal generated by the second communicationprocessor 514 into an RF signal (hereinafter referred to as an “IFsignal”) in an intermediate frequency band (e.g., ranging fromapproximately 9 GHz to approximately 11 GHz) and may provide the IFsignal to the third RFIC 526. The third RFIC 526 may convert the IFsignal into the 5G Above6 RF signal. In the case of receiving a signal,the 5G Above6 RF signal may be received from the second cellular network594 (e.g., a 5G network) through an antenna (e.g., the antenna 548) andmay be converted into an IF signal by the third RFIC 526. The fourthRFIC 528 may convert the IF signal into a baseband signal so as to beprocessed by the second communication processor 514.

According to an embodiment, the first RFIC 522 and the second RFIC 524may be implemented with a single chip or at least a portion of a singlepackage. According to an embodiment, the first RFFE 532 and the secondRFFE 534 may be implemented with a single chip or at least a portion ofa single package. According to an embodiment, at least one of the firstantenna module 542 or the second antenna module 544 may be omitted ormay be combined with any other antenna module to process RF signals in aplurality of bands.

According to an embodiment, the third RFIC 526 and the antenna 548 maybe disposed at the same substrate to form a third antenna module 546.For example, the wireless communication module 192 or the processor 120may be disposed at a first substrate (e.g., a main PCB). In this case,the third RFIC 526 may be disposed at a partial region (e.g., on a lowersurface) of a second substrate (e.g., a sub PCB) independent of thefirst substrate, the antenna 548 may be disposed at another partialregion (e.g., on an upper surface) of the second substrate, and thethird RFIC 526 may be implemented with the third RFIC 526 and theantenna 548 thus disposed. As the third RFIC 526 and the antenna 548 aredisposed at the same substrate, it may be possible to decrease a lengthof a transmission line between the third RFIC 526 and the antenna 548.The decrease in the transmission line may make it possible to reduce theloss (or attenuation) of a signal in a high-frequency band (e.g.,ranging from approximately 6 GHz to approximately 60 GHz) used for the5G network communication due to the transmission line. As such, theelectronic device 101 may improve the quality or speed of communicationwith the second cellular network 594 (e.g., a 5G network).

According to an embodiment, the antenna 548 may be formed of an antennaarray that includes a plurality of antenna elements capable of beingused for beamforming. In this case, the third RFIC 526 may include, forexample, a plurality of phase shifters 538 corresponding to theplurality of antenna elements as a portion of the third RFFE 536. In thecase of transmitting a signal, each of the plurality of phase shifters538 may shift a phase of the 5G Above6 RF signal to be transmitted tothe outside (e.g., a base station of a 5G network) of the electronicdevice 101 through the corresponding antenna element. In the case ofreceiving a signal, each of the plurality of phase shifters 538 mayshift a phase of the 5G Above6 RF signal received from the outsidethrough the corresponding antenna element to the same or substantiallythe same phase. This may enable the transmission or reception betweenthe electronic device 101 and the outside through the beamforming.

The second cellular network 594 (e.g., a 5G network) may be usedindependently of the first cellular network 592 (e.g., a legacy network)(e.g., stand-alone (SA)) or may be used in conjunction with the firstcellular network 592 (e.g., non-stand alone (NSA)). For example, only anaccess network (e.g., a 5G radio access network (RAN) or a nextgeneration RAN (NG RAN)) may be present in the 5G network, and a corenetwork (e.g., a next generation core (NGC)) may be absent from the 5Gnetwork. In this case, the electronic device 101 may access the accessnetwork of the 5G network and may access an external network (e.g.,Internet) under control of a core network (e.g., an evolved packed core(EPC)) of the legacy network. Protocol information (e.g., LTE protocolinformation) for communication with the legacy network or protocolinformation (e.g., New Radio (NR) protocol information) forcommunication with the 5G network may be stored in the memory 130 so asto be accessed by any other component (e.g., the processor 120, thefirst communication processor 512, or the second communication processor514).

FIG. 6 illustrates a block diagram of an antenna module according to anembodiment of the disclosure.

Referring to FIG. 6, an antenna module 600 (e.g., the third antennamodule 546 of FIG. 5) may include a communication circuit 630 (e.g., thethird RFIC 526 of FIG. 5) disposed on a printed circuit board (PCB) 650,the PCB 650, at least one antenna element (AE) group (e.g., a first AEgroup 640), and/or a second AE group 645. For example, the first AEgroup 640 and the second AE group 645 may be respectively referred to asa “first antenna array” and a “second antenna array”. For example, eachof antenna elements (e.g., conductive plates) included in the first AEgroup 640 and/or the second AE group 645 may be referred to as an“antenna” (e.g., at least a portion of the antenna 548 of FIG. 5). Forexample, in the case where at least some of the antenna elementsincluded in the first AE group 640 and/or the second AE group 645 aresimultaneously used in a beamforming operation, at least some antennaelements used in the beamforming operation from among the antennaelements may operate as one array antenna. In this case, the arrayantenna may form a beam having directivity in at least one specifieddirection.

According to an embodiment, the first AE group 640 or the second AEgroup 645 may be disposed on a first surface of the PCB 650, and thecommunication circuit 630 (e.g., the third RFIC 526 of FIG. 5) may bedisposed on a second surface of the PCB 650. The PCB 650 may include acoaxial cable connector or a board to board (B-to-B) connector forelectrical connection with another PCB (e.g., the printed circuit board440 or the second support member 460 of FIG. 4) by using a transmissionline.

According to an embodiment, the first AE group 640 or the second AEgroup 645 may include a plurality of conductive plates (e.g., antennaelements). Each of the plurality of antenna elements may include a patchantenna, a shorted patch antenna, a loop antenna, a notch antenna, aslot antenna, or a dipole antenna. According to an embodiment, aplurality of antenna elements belonging to the first AE group 640 mayform one array antenna. For example, the antenna module 600 may performbeamforming by using the antenna elements of the first AE group 640.According to an embodiment, a plurality of antenna elements belonging tothe second AE group 645 may form one array antenna. For example, thecommunication circuit 630 may perform beamforming by using the antennaelements (e.g., patch antennas) of the second AE group 645. According toan embodiment, the communication circuit 630 may perform beamforming byusing the antenna elements of the first AE group 640 and the second AEgroup 645. According to an embodiment, each of the antenna elementsbelonging to the second AE group 645 may operate as a single antenna.For example, each of the antenna elements included in the second AEgroup 645 may be a dipole antenna.

According to an embodiment, at least a portion of the PCB 650 may beimplemented with a flexible PCB. For example, the PCB 650 may include aplurality of PCBs, and at least some of the plurality of PCBs may be aflexible PCB (FPCB). According to an embodiment, the first AE group 640and the second AE group 645 may be placed on different PCBs. Forexample, a PCB on which the first AE group 640 and a PCB on which thesecond AE group 645 is positioned may be physically and/or electricallyconnected through an FPCB.

Each of the antenna elements included in the first AE group 640 and thesecond AE group 645 may be referred to as a “conductive plate” or a“conductive pattern”.

FIG. 7 is a front perspective view of an antenna module according to anembodiment of the disclosure.

Referring to FIG. 7, according to an embodiment, an antenna module 700may include a first AE group 740 (e.g., the first AE group 640 of FIG.6) disposed on a front surface of a PCB 750 (e.g., the PCB 650 of FIG.6) (e.g., in a direction being parallel to an X-Y plane and facing apositive direction of a Z-axis). The antenna module 700 may include atleast one communication circuit (not illustrated) (e.g., thecommunication circuit 630 of FIG. 6) disposed on a back surface of thePCB 750 (e.g., in a direction being parallel to the X-Y plane and facinga negative direction of the Z-axis).

According to an embodiment, the first AE group 740 may include aplurality of patch antenna elements 741, 742, 743, and 744. Each of theplurality of patch antenna elements 741, 742, 743, and 744 may beconnected with a transmission line through at least one feeding point.For example, each of the plurality of patch antenna elements 741, 742,743, and 744 may be connected to the communication circuit through atleast one transmission line that is formed at the interior of the PCB750.

According to an embodiment, each of the plurality of patch antennaelements 741, 742, 743, and 744 may transmit/receive a signal by using abeam having a radiation pattern that is formed around a direction (e.g.,the positive direction of the Z-axis) that a front surface of each ofthe plurality of patch antenna elements 741, 742, 743, and 744 faces.

According to an embodiment, the antenna module 700 may performbeamforming by using at least two or more antenna elements of theplurality of patch antenna elements 741, 742, 743, and 744. For example,the antenna module 700 may change a radiation direction and/or a shapeof one beam formed by the plurality of patch antenna elements 741, 742,743, and 744, by shifting phases associated with at least two or moreantenna elements of the plurality of patch antenna elements 741, 742,743, and 744.

In FIG. 7, the number of patch antenna elements 741, 742, 743, and 744and a shape thereof are merely examples, and the embodiments of thedisclosure are not limited thereto. For example, the first AE group 740may include two or more patch antenna elements, and each of the patchantenna elements may be formed in the shape of a square. For example,the first AE group 740 may be a (4×1) array antenna, but the first AEgroup 740 may be an array antenna having a different form (e.g., 2×2)

FIG. 8 is a perspective view of an antenna module according to anembodiment of the disclosure.

Referring to FIG. 8, according to an embodiment, an antenna module 800may include a first AE group 840 (e.g., the first AE group 640 of FIG.6) and a second AE group 845 disposed on a front surface of a PCB 850(e.g., the PCB 650 of FIG. 6) (e.g., in a direction being parallel tothe X-Y plane and facing the positive direction of the Z-axis). Theantenna module 800 may include at least one communication circuit (notillustrated) (e.g., the communication circuit 630 of FIG. 6) disposed ona back surface of the PCB 750 (e.g., in a direction being parallel tothe X-Y plane and facing the negative direction of the Z-axis).According to an embodiment, the first AE group 840 may include aplurality of patch antenna elements 841, 842, 843, and 844. A furtherdescription associated with the first AE group 840 may be referenced bythe description associated with the first AE group 740 of FIG. 7, andthus, for convenience of description, additional description will beomitted to avoid redundancy.

According to an embodiment, the second AE group 845 may include aplurality of dipole antenna elements 801, 811, 821, and 831 and aplurality of shorted patch elements 802, 803, 812, 813, 822, 823, 832,and 833. For example, the plurality of dipole antenna elements 801, 811,821, and 831 may transmit/receive a signal by using a beam correspondingto a radiation pattern generated toward one side surface of the antennamodule 800 (e.g., around a positive direction of a Y-axis). In the caseof the dipole antenna elements 801, 811, 821, and 831, a null point maybe present in a longitudinal direction of the dipole antenna elements801, 811, 821, and 831 (e.g., a direction of a long axis of a radiatorof a dipole antenna). For example, the shorted patch elements 802, 803,812, 813, 822, 823, 832, and 833 may include feeding conductive plates802, 812, 822, and 832 and ground (GND) conductive plates 803, 813, 823,and 833 respectively corresponding to the feeding conductive plates 802,812, 822, and 832. The shorted patch elements 802, 803, 812, 813, 822,823, 832, and 833 may be used to supplement the beam coverage of thedipole antenna elements 801, 811, 821, and 831.

According to an embodiment, the antenna module 800 may performbeamforming by changing phases of a plurality of antenna elementsbelonging to the second AE group 845.

According to an embodiment, each of the antenna elements of the secondAE group 845 may be connected with a transmission line through at leastone feeding point. For example, each of the antenna elements of thesecond AE group 845 may be connected to a communication circuit throughat least one transmission line formed at the interior of the PCB 850.

In FIG. 8, the number of antenna elements of the second AE group 845 anda shape thereof are merely examples, and the embodiments of thedisclosure are not limited thereto. For example, the second AE group 845may include two or more dipole antenna elements and may not include ashorted patch antenna element.

FIG. 9A is a perspective view of an antenna module according to anembodiment of the disclosure.

Referring to FIG. 9A, according to an embodiment, an antenna module 900may include a first AE group 940 (e.g., the first AE group 640 of FIG.6) disposed on a front surface of a first PCB 951 (e.g., in a directionbeing parallel to the X-Y plane and facing the positive direction of theZ-axis), and a second AE group 945 (e.g., the second AE group 645 ofFIG. 6) disposed on a third PCB 953. For example, the first PCB 951 andthe third PCB 953 may be electrically and/or physically connectedthrough a connection member 952. For example, the connection member 952may be a flexible material (e.g., an FPCB).

According to an embodiment, the antenna module 900 may include at leastone communication circuit (not illustrated) (e.g., the communicationcircuit 630 of FIG. 6) disposed on a back surface of the first PCB 951(e.g., in a direction being parallel to the X-Y plane and facing thenegative direction of the Z-axis). According to an embodiment, the firstAE group 940 may include a plurality of patch antenna elements 941, 942,943, and 944. A further description associated with the first AE group940 may be referenced by the description associated with the first AEgroup 740 of FIG. 7, and thus, for convenience of description,additional description will be omitted to avoid redundancy.

According to an embodiment, the second AE group 945 may include aplurality of dipole antenna elements 911, 921, and 931 and a pluralityof shorted patch elements 912, 913, 922, 923, 932, and 933. Descriptionsassociated with the dipole antenna elements 911, 921, and 931 and theplurality of shorted patch elements 912, 913, 922, 923, 932, and 933 maybe referenced by the descriptions associated with the second antennaelement group 845 of FIG. 8.

According to an embodiment, when the antenna module 900 is mounted on anelectronic device (e.g., the electronic device 200 of FIG. 2), theelectronic device may cover a plurality of directions by using the firstAE group 940 and the second AE group 945. For example, the electronicdevice may cover a direction facing a back surface of the electronicdevice (e.g., a direction perpendicular to the back plate 211 of FIG. 3)by using the first AE group 940 and may cover a direction between afront surface (e.g., the first surface 210A of FIG. 2) and a sidesurface (e.g., the side surface 210C of FIG. 2) of the electronic deviceby using the second AE group 945.

FIG. 9B is a perspective view of an antenna module according to anembodiment of the disclosure.

Referring to FIG. 9B, according to an embodiment, the antenna module 900may include the first AE group 940 (e.g., the first AE group 640 of FIG.6) disposed on the front surface of the first PCB 951 (e.g., in adirection being parallel to the X-Y plane and facing the positivedirection of the Z-axis), and the second AE group 945 (e.g., the secondAE group 645 of FIG. 6) disposed on the third PCB 953. For example, thefirst PCB 951 and the third PCB 953 may be electrically and/orphysically connected through the connection member 952. For example, theconnection member 952 may be a flexible material (e.g., an FPCB).

According to an embodiment, the antenna module 900 may include at leastone communication circuit (not illustrated) (e.g., the communicationcircuit 630 of FIG. 6) disposed on the back surface of the first PCB 951(e.g., in a direction being parallel to the X-Y plane and facing thenegative direction of the Z-axis). According to an embodiment, the firstAE group 940 may include a plurality of patch antenna elements 941, 942,943, and 944. A further description associated with the first AE group940 may be referenced by the description associated with the first AEgroup 740 of FIG. 7, and thus, for convenience of description,additional description will be omitted to avoid redundancy.

According to an embodiment, the second AE group 945 may include aplurality of patch antenna elements 914, 924, and 934. The patch antennaelements 914, 924, and 934 may transmit/receive a signal by using a beamcorresponding to a radiation pattern generated toward one side surfaceof the antenna module 900 (e.g., around a direction perpendicular to afront surface of the third PCB 953).

According to an embodiment, when the antenna module 900 is mounted on anelectronic device (e.g., the electronic device 200 of FIG. 2), theelectronic device may cover a plurality of directions by using the firstAE group 940 and the second AE group 945. For example, the electronicdevice may cover a direction facing the back surface of the electronicdevice (e.g., a direction perpendicular to the back plate 211 of FIG. 3)by using the first AE group 940 and may cover a direction between afront surface (e.g., the first surface 210A of FIG. 2) and a sidesurface (e.g., the side surface 210C of FIG. 2) of the electronic deviceby using the second AE group 945. For example, to secure the coverage ofthe electronic device, the third PCB 953 of the antenna module 900 maybe mounted in the electronic device in a state of being tilted toward adisplay so as to face a direction between the front surface and the sidesurface of the electronic device. For another example, to secure thecoverage of the electronic device, the third PCB 953 of the antennamodule 900 may be mounted in the electronic device so as to face towardthe side surface of the electronic device. For another example, theantenna module 900 may be mounted in the electronic device in a state ofbeing tilted to face a direction between the back plate and the sidesurface of the electronic device.

Examples are illustrated in FIGS. 9A and 9B as the connecting member 952and the third PCB 953 are separate PCBs, but the connecting member 952and the third PCB 953 may be implemented with one FPCB. In this case,the dipole antenna elements 911, 921, and 931 may be formed ofconductive patterns on the FPCB.

First Embodiment

FIG. 10 is a view illustrating antenna modules disposed in an electronicdevice, according to an embodiment of the disclosure.

Referring to FIG. 10, according to an embodiment, an electronic device1000 (e.g., the electronic device 101 of FIG. 1) may include a firstantenna module 1010, a second antenna module 1020, and a third antennamodule 1030. For example, FIG. 10 illustrates an inner appearance of theelectronic device 1000 when viewing the electronic device 1000 from theback surface of the electronic device 1000. For example, FIG. 10 mayillustrate the interior of the electronic device 1000 viewed from theback surface of the electronic device 1000 in one direction (e.g., thenegative direction of the Z-axis), after removing a back plate (e.g.,the back plate 480 of FIG. 4) and an antenna (e.g., the antenna 470 ofFIG. 4) of the electronic device 1000. For another example, FIG. 10 mayillustrate the interior of the electronic device 1000 viewed from theback surface of the electronic device 1000 in the one direction, afterremoving the back plate, the antenna, and a second support member (e.g.,the second support member 460 of FIG. 4) of the electronic device 1000.

According to an embodiment, at least a portion of the side bezelstructure 410 (e.g., a front metal) may be used as a radiator fortransmitting/receiving a wireless signal (e.g., a wireless signal of 6GHz or lower) of legacy cellular communication (e.g., 3G and 4G mobilecommunication). For example, the side bezel structure 410 may correspondto at least a portion of an antenna including a plurality of legacyfeeding points and a plurality of legacy GNDs. According to anembodiment, the side bezel structure 410 may be physically connectedwith a first support member (e.g., the first support member 411 (e.g., abracket) of FIG. 4) placed at the inside of the side bezel structure410, and at least a portion of the side bezel structure 410 may beinsulated from the first support member.

According to an embodiment, the first antenna module 1010 may be placedon the upper right of the back surface of the electronic device 1000 inFIG. 10. For example, the first antenna module 1010 may be disposed at alocation where at least a portion of the first antenna module 1010overlaps a speaker 1060 (e.g., the sound output device 155 of FIG. 1)and/or a sensor part/SIM socket 1050, when viewed from a side surface ofthe electronic device 1000 (e.g., a positive direction of an X-axis or anegative direction of the X-axis). For example, the first antenna module1010 may be disposed at a location where the first antenna module 1010does not overlap the speaker 1060 and/or the sensor part/SIM socket1050, when viewed from the back surface of the electronic device 1000.For example, the sensor part/SIM socket 1050 may include various sensors(e.g., a proximity sensor and/or a front image sensor (e.g., a frontcamera)). For example, the sensor part/SIM socket 1050 may accommodate auser identification module and/or an external electronic medium. Forexample, the first antenna module 1010 may be placed above a camera andfingerprint recognition module 1040 so as to be adjacent to the sidebezel structure 410. For example, the first antenna module 1010 may beplaced between the printed circuit board 440 and the back plate of theelectronic device 1000. For example, the first antenna module 1010 maybe placed not to overlap electronic components (e.g., the camera andfingerprint recognition module 1040, the sensor part/SIM socket 1050,and the speaker 1060) of the electronic device 1000 on one plane (e.g.,the X-Y plane).

According to various embodiments, the first antenna module 1010 maycorrespond to the antenna module 800 of FIG. 8.

According to an embodiment, the first antenna module 1010 may include aplurality of patch antenna elements (e.g., the first AE group 840 ofFIG. 8) disposed to face the back surface of the electronic device 1000.The first antenna module 1010 may transmit/receive a wireless signal byusing a beam having a radiation pattern that is generated around adirection (e.g., the positive direction of the Z-axis) from the backsurface of the electronic device 1000 to the outside of the electronicdevice 1000 by using the plurality of patch antenna elements. Forexample, the electronic device 1000 may implement the coverage towardthe back surface of the electronic device 1000 by using the plurality ofpatch antenna elements of the first antenna module 1010. For example,the first antenna module 1010 may generate a beam, which is radiatedfrom the interior of the electronic device 1000 to the outside of theelectronic device 1000, through a non-conductive back plate (e.g., theback plate 480 of FIG. 4) of the electronic device 1000.

According to an embodiment, the first antenna module 1010 may include aplurality of dipole antenna elements and a plurality of shorted patchantennas (e.g., the second AE group 845 of FIG. 8). The first antennamodule 1010 may generate a beam having a radiation pattern around adirection (e.g., the positive direction of the Y-axis) from the interiorof the electronic device 1000 to the outside above an upper side surfaceof the electronic device 1000 and a display direction (e.g., a directionbetween the positive Y-axis direction and the negative Z-axis directionon an Y-Z plane), by using the plurality of dipole antenna elements andthe plurality of shorted patch antenna elements. For example, theelectronic device 1000 may implement the coverage in front of an upperside surface of the electronic device 1000 by using the plurality ofdipole antenna elements and the plurality of shorted patch antennaelements. For example, the first antenna module 1010 may generate abeam, which is radiated from the interior of the electronic device 1000to the outside of the electronic device 1000, through the back plate ofthe electronic device 1000 and a non-conductive region of the side bezelstructure 410.

According to an embodiment, the second antenna module 1020 may be placedon the upper left of the back surface of the electronic device 1000 inFIG. 10. For example, the second antenna module 1020 may be disposed ata location where at least a portion of the second antenna module 1020overlaps the camera and fingerprint recognition module 1040, when viewedfrom a side surface of the electronic device 1000 (e.g., the positivedirection of the X-axis or the negative direction of the X-axis). Forexample, the second antenna module 1020 may be placed on the left of thecamera and fingerprint recognition module 1040 so as to be adjacent tothe side bezel structure 410, when viewed from the back surface of theelectronic device 1000. For example, the second antenna module 1020 maybe disposed at the electronic device 1000 such that a PCB of the secondantenna module 1020 is perpendicular to a front display or the backplate of the electronic device 1000.

According to various embodiments, the second antenna module 1020 maycorrespond to the antenna module 700 of FIG. 7. According to anembodiment, the second antenna module 1020 may include a plurality ofpatch antenna elements (e.g., the first AE group 740 of FIG. 7) disposedto face the left side surface of the electronic device 1000 (e.g., thenegative direction of the X-axis), when viewing the electronic device1000 from the back surface of the electronic device 1000. The secondantenna module 1020 may transmit/receive a wireless signal by using abeam having a radiation pattern that is generated around a direction(e.g., the negative direction of the X-axis) from the interior of theelectronic device 1000 to the outside on one side of the electronicdevice 1000, by using the plurality of patch antenna elements. Forexample, the electronic device 1000 may implement the coverage towardthe left side surface of the electronic device 1000 by using theplurality of patch antenna elements of the second antenna module 1020.For example, the second antenna module 1020 may generate a beam, whichis radiated from the interior of the electronic device 1000 to theoutside of the electronic device 1000, through a non-conductive regionof the side bezel structure 410 and a non-conductive back plate of theelectronic device 1000.

According to an embodiment, the third antenna module 1030 may be placedon the lower right of the back surface of the electronic device 1000 inFIG. 10. For example, the third antenna module 1030 may be disposed at alocation where at least a portion of the third antenna module 1030overlaps the battery 450, when viewed from a side surface of theelectronic device 1000 (e.g., the positive direction of the X-axis orthe negative direction of the X-axis). For example, the third antennamodule 1030 may be placed between the battery 450 and the side bezelstructure 410, when viewed from the back surface of the electronicdevice 1000. For example, the third antenna module 1030 may be disposedwithin the electronic device 1000 such that a PCB of the third antennamodule 1030 is perpendicular to the front display or the back plate ofthe electronic device 1000.

According to various embodiments, the third antenna module 1030 maycorrespond to the antenna module 700 of FIG. 7. According to anembodiment, the third antenna module 1030 may include a plurality ofpatch antenna elements (e.g., the first AE group 740 of FIG. 7) disposedto face the right side surface of the electronic device 1000 (e.g., thepositive direction of the X-axis), when viewing the electronic device1000 from the back surface of the electronic device 1000. The thirdantenna module 1030 may transmit/receive a wireless signal by using abeam having a radiation pattern that is generated around a direction(e.g., the positive direction of the X-axis) from the interior of theelectronic device 1000 to the outside of the electronic device 1000 byusing the plurality of patch antenna elements. For example, theelectronic device 1000 may implement the coverage toward the right sidesurface of the electronic device 1000 by using the plurality of patchantenna elements of the third antenna module 1030. For example, thethird antenna module 1030 may generate a beam, which is radiated fromthe interior of the electronic device 1000 to the outside of theelectronic device 1000, through a non-conductive region of the sidebezel structure 410 and/or a non-conductive back plate of the electronicdevice 1000.

According to an embodiment, the first antenna module 1010 and the secondantenna module 1020 may be grounded through electrical connection with aground region of the printed circuit board 440 that is placed adjacentto the first antenna module 1010 and the second antenna module 1020.According to an embodiment, the third antenna module 1030 may begrounded through electrical connection with the side bezel structure 410adjacent to the third antenna module 1030. For example, because thirdantenna module 1030 is disposed on one side of the battery 450, thethird antenna module 1030 thus disposed may be spatially spaced from theprinted circuit board 440. In this case, the side bezel structure 410may provide a ground for the third antenna module 1030 by forming legacyground points at corresponding portions of the side bezel structure 410above and below the third antenna module 1030. For example, a legacy GNDmay be placed adjacent to the third antenna module 1030 compared to alegacy feeding point.

In the embodiment of FIG. 10, because the second antenna module 1020 andthe third antenna module 1030 are mounted to be perpendicular to adisplay plane of the electronic device 1000, the second antenna module1020 and/or the third antenna module 1030 may not include dipole antennaelements for the purpose of reducing the thickness of the electronicdevice 1000. Because the first antenna module 1010 is mounted parallelto the display plane, the first antenna module 1010 may increase thecoverage of the electronic device 1000 by using dipole antenna elements.Null points of the negative X-axis direction and the positive X-axisdirection generated by the dipole antenna elements of the first antennamodule 1010 may be covered by the second antenna module 1020 and thethird antenna module 1030.

FIG. 11 is a cross-sectional view of an electronic device according toan embodiment of the disclosure.

Referring to FIG. 11, the cross-sectional view may correspond to across-sectional view observed when a cross section of the electronicdevice 1000 taken along axis A-A′ of FIG. 10 is viewed in a +X to −Xdirection. According to various embodiments, the first antenna module1010 may be disposed substantially parallel to the front plate 420 andthe display 430 and may be disposed to face the back plate 480.

According to an embodiment, a C clip 1140 may electrically connect theprinted circuit board 440 and a conductive portion (e.g., a metallicportion) of the side bezel structure 410. For example, the side bezelstructure 410 may be electrically connected with the ground region ofthe printed circuit board 440 through the C clip 1140. For anotherexample, the side bezel structure 410 may be supplied with a powerthrough the C clip 1140. At least a portion of the side bezel structure410 may be electrically connected with the printed circuit board 440 tooperate as a legacy antenna.

According to an embodiment, the C clip 1140 may connect the side bezelstructure 410 to a legacy ground. For example, a legacy ground on axisA-A′ of FIG. 10 may be formed by the C clip 1140. In the example of FIG.11, according to an embodiment, the C clip 1140 may be placed betweenthe first antenna module 1010 and the side bezel structure 410. Forexample, a contact between the C clip 1140 and the side bezel structure410 may be placed to be lower than a beam direction (e.g., a firstdirection) of the first antenna module 1010 or at a lower point than thefirst antenna module 1010. The influence of the legacy ground of the Cclip 1140 on the first antenna module 1010 may be minimized by setting alocation of the contact between the C clip 1140 and the side bezelstructure 410 to be relatively lower than the first antenna module 1010(or to be placed below the first antenna module 1010).

For example, the C clip 1140 may be referred to as a “connection member”that electrically connects the printed circuit board 440 and the sidebezel structure 410. The C clip 1140 is an example of a connectionmember, and embodiments of the disclosure are not limited thereto. Forexample, the C clip 1140 may be replaced with a connection member forelectrically connecting the side bezel structure 410 and the printedcircuit board 440, such as a screw contact, a double-sided adhesive tape(e.g., a conductive adhesive tape), an RF cable, an FPCB, or the like.

According to an embodiment, a component of the electronic device 1000placed on a line of sight of the first antenna module 1010 may be formedof a non-conductive material. The first antenna module 1010 may beplaced to radiate a signal through the back plate 480 and anon-conductive region 1150 of the side bezel structure 410. For example,the back plate 480 may be formed of a non-conductive material (e.g.,polymer). For example, the non-conductive region 1150 may be placed at aportion of the side bezel structure 410, and the dipole antenna elementsand the shorted antenna elements of the first antenna module 1010 mayform a beam from the interior of the electronic device 1000 to theoutside of the electronic device 1000 through the non-conductive region1150 and the back plate 480. For example, the first direction mayindicate the line of sight that is able to be generated by the dipoleantenna elements and the shorted antenna elements of the first antennamodule 1010.

According to an embodiment, the first antenna module 1010 may be placedbetween the printed circuit board 440 and the back plate 480, and aninterposer 1120 may be placed between the first antenna module 1010 andthe printed circuit board 440. For example, the interposer 1120 may beany structure (e.g., a PCB, a shield can, or a non-conductive structure)that allows the first antenna module 1010 to be disposed adjacent to theback plate 480. For example, in FIG. 11, the interposer 1120 may allow alocation of the first antenna module 1010 to be higher than (e.g., withrespect to the Z-axis) a conductive region (e.g., a metallic region) ofthe side bezel structure 410, and thus, the first antenna module 1010may form a beam toward the display 430. For example, an interval may beformed between the first antenna module 1010 and the conductive regionof the side bezel structure 410 by using the interposer 1120, whenviewed from one side of the electronic device 1000 (e.g., the positivedirection of the X-axis or the negative direction of the X-axis).

According to an embodiment, the non-conductive region 1150 of the sidebezel structure 410 may be produced by a process at least including aninjection-molding process. For example, the non-conductive region 1150may be placed at the side bezel structure 410 through a doubleinjection-molding process.

According to an embodiment, the non-conductive region 1150 of the sidebezel structure 410 may not be viewable from the outside. For example,as the non-conductive region 1150 is covered by the back plate 480, thenon-conductive region 1150 may not be exposed to the outside. Forexample, only at least a portion of a conductive region (e.g., ametallic portion) of the side bezel structure 410 may be exposed to theoutside.

FIG. 12 is a cross-sectional view of an electronic device according toan embodiment of the disclosure.

Referring to FIG. 12, the cross-sectional view may correspond to across-sectional view observed when a cross section of the electronicdevice 1000 taken along axis B-B′ of FIG. 10 is viewed in a +Y to −Ydirection. According to various embodiments, the second antenna module1020 may be disposed substantially perpendicular to the front plate 420and the display 430 and may be disposed to face a side surface of theelectronic device 1000.

According to an embodiment, the second antenna module 1020 may bephysically fixed by the first support member 411 (e.g., a bracket). Thefirst support member 411 may be physically connected with the side bezelstructure 410.

According to an embodiment, a component of the electronic device 1000placed on a line of sight of the second antenna module 1020 may beformed of a non-conductive material. The second antenna module 1020 maybe placed to radiate a signal through the back plate 480 beingnon-conductive and a non-conductive region 1230 of the side bezelstructure 410. For example, the back plate 480 may be formed of anon-conductive material (e.g., polymer). For example, the non-conductiveregion 1230 may be placed at a portion of the side bezel structure 410,and the patch antenna elements of the second antenna module 1020 mayform a beam from the interior of the electronic device 1000 to theoutside of the electronic device 1000 through the non-conductive region1230 and the back plate 480.

According to an embodiment, the non-conductive region 1230 of the sidebezel structure 410 may be produced by a process at least including theinjection-molding process. For example, the non-conductive region 1230may be placed at the side bezel structure 410 through the doubleinjection-molding process.

According to an embodiment, the non-conductive region 1230 of the sidebezel structure 410 may not be viewable from the outside. For example,as the non-conductive region 1230 is covered by the back plate 480, thenon-conductive region 1230 may not be exposed to the outside. Forexample, only a conductive region (e.g., a metallic portion) of the sidebezel structure 410 may be exposed to the outside.

The mounting structure of the second antenna module 1020 described withreference to FIG. 12 may be similarly applied to the third antennamodule 1030.

According to an embodiment, a C clip 1245 may electrically connect theprinted circuit board 440 and a conductive portion (e.g., a metallicportion) of the side bezel structure 410. For example, the side bezelstructure 410 may be electrically connected with the ground region ofthe printed circuit board 440 through the C clip 1245. For anotherexample, the side bezel structure 410 may be supplied with a powerthrough the C clip 1245. At least a portion of the side bezel structure410 may be electrically connected with the printed circuit board 440 tooperate as a legacy antenna.

According to an embodiment, the C clip 1245 may connect the side bezelstructure 410 to a legacy ground. For example, a legacy ground on axisB-B′ of FIG. 10 may be formed by the C clip 1245. In the example of FIG.12, according to an embodiment, the C clip 1245 may be placed fartherfrom the side bezel structure 410 than the second antenna module 1020(e.g., to be closer to the inside of the electronic device 200 than thesecond antenna module 1020). For example, a contact between the C clip1245 and the side bezel structure 410 may be placed in back of thesecond antenna module 1020 (e.g., a backward direction) such that thecontact does not exist in the beam direction (e.g., the negativedirection of the Y-axis) of the second antenna module 1020. Theinfluence of the legacy ground of the C clip 1245 on the second antennamodule 1020 may be minimized by setting a location of the contactbetween the C clip 1245 and the side bezel structure 410 to be in backof the second antenna module 1020.

For example, the C clip 1245 may be referred to as a “connection member”that electrically connects the printed circuit board 440 and the sidebezel structure 410. The C clip 1245 is an example of a connectionmember, and embodiments of the disclosure are not limited thereto. Forexample, the C clip 1245 may be replaced with a connection member forelectrically connecting the side bezel structure 410 and the printedcircuit board 440, such as a screw contact, a double-sided adhesive tape(e.g., a conductive adhesive tape), an RF cable, an FPCB, or the like.

Second Embodiment

FIG. 13 is a view illustrating antenna modules disposed in an electronicdevice, according to an embodiment of the disclosure.

Referring to FIG. 13, according to an embodiment, an electronic device1300 (e.g., the electronic device 101 of FIG. 1) may include a firstantenna module 1310, a second antenna module 1320, and a third antennamodule 1330. For example, FIG. 13 illustrates an inner appearance of theelectronic device 1300 when viewing the electronic device 1300 from aback surface of the electronic device 1300. For example, FIG. 13 mayillustrate the interior of the electronic device 1300 viewed from theback surface of the electronic device 1300 in one direction (e.g., thenegative direction of the Z-axis), after removing a back plate (e.g.,the back plate 480 of FIG. 4) and an antenna (e.g., the antenna 470 ofFIG. 4) of the electronic device 1300. For another example, FIG. 13 mayillustrate the interior of the electronic device 1300 viewed from theback surface of the electronic device 1300 in the one direction, afterremoving the back plate, the antenna, and a second support member (e.g.,the second support member 460 of FIG. 4) of the electronic device 1300.

According to an embodiment, at least a portion of the side bezelstructure 410 (e.g., a front metal) may be used as a radiator fortransmitting/receiving a wireless signal (e.g., a wireless signal of 6GHz or lower) of legacy cellular communication (e.g., 3G and 4G mobilecommunication). For example, the side bezel structure 410 may correspondto at least a portion of an antenna including a plurality of legacyfeeding points and a plurality of legacy GNDs. According to anembodiment, the side bezel structure 410 may be physically connectedwith a first support member (e.g., the first support member 411 (e.g., abracket) of FIG. 4) placed at the inside of the side bezel structure410, and at least a portion of the side bezel structure 410 may beinsulated from the first support member.

According to an embodiment, the first antenna module 1310 may be placedon the upper middle of the back surface of the electronic device 1300 inFIG. 13. For example, the first antenna module 1310 may be disposedabove a speaker 1360. For example, the first antenna module 1310 may bedisposed not to overlap the speaker 1360 (e.g., the sound output device155 of FIG. 1), when viewed from a side surface of the electronic device1300 (e.g., the positive direction of the X-axis or the negativedirection of the X-axis). For example, the first antenna module 1310 maybe placed between the printed circuit board 440 and the back plate ofthe electronic device 1300.

According to various embodiments, the first antenna module 1310 maycorrespond to the antenna module 800 of FIG. 8. A radiation pattern anda mounting structure of the first antenna module 1310 may be referencedby the description of the first antenna module 1010 given with referenceto FIGS. 10 and 11, and thus, for convenience of description, additionaldescription will be omitted to avoid redundancy.

According to various embodiments, the second antenna module 1320 may beplaced on the upper left of the back surface of the electronic device1300 in FIG. 13. For example, the second antenna module 1320 may bedisposed at a location where at least a portion of the second antennamodule 1320 overlaps a camera module 1340, when viewed from a sidesurface of the electronic device 1300 (e.g., the positive direction ofthe X-axis or the negative direction of the X-axis). For example, thesecond antenna module 1320 may be placed on the left of the cameramodule 1340 so as to be adjacent to the side bezel structure 410, whenviewed from the back surface of the electronic device 1300. For example,the second antenna module 1320 may be disposed within the electronicdevice 1300 such that a PCB of the second antenna module 1320 isparallel to the front display or the back plate of the electronic device1300.

According to various embodiments, the second antenna module 1320 maycorrespond to the antenna module 800 of FIG. 8. According to anembodiment, the second antenna module 1320 may include a plurality ofpatch antenna elements (e.g., the first AE group 840 of FIG. 8) disposedto face the back surface of the electronic device 1300 (e.g., thepositive direction of the Z-axis), when viewing the electronic device1300 from the back surface of the electronic device 1300. The secondantenna module 1320 may transmit/receive a wireless signal by using abeam having a radiation pattern that is generated around a direction(e.g., the positive direction of the Z-axis) from the interior of theelectronic device 1300 to the outside on one side of the electronicdevice 1300 by using the plurality of patch antenna elements.

According to an embodiment, the second antenna module 1320 may include aplurality of dipole antenna elements and a plurality of shorted patchantenna elements (e.g., the second AE group 845 of FIG. 8). The secondantenna module 1320 may generate a beam having a radiation patternaround a direction (e.g., the negative direction of the X-axis) from theinterior of the electronic device 1300 to the left of the electronicdevice 1300 and a display direction (e.g., a direction between thenegative X-axis direction and the negative Z-axis direction on an X-Zplane) by using the plurality of dipole antenna elements and theplurality of shorted patch antennas. For example, the second antennamodule 1320 may generate a beam, which is radiated from the interior ofthe electronic device 1300 to the outside of the electronic device 1300,through the back plate of the electronic device 1300 and anon-conductive region of the side bezel structure 410.

According to various embodiments, the third antenna module 1330 may beplaced on the lower right of the back surface of the electronic device1300 in FIG. 13. For example, the third antenna module 1330 may bedisposed at a location where at least a portion of the third antennamodule 1330 overlaps the battery 450, when viewed from a side surface ofthe electronic device 1300 (e.g., the positive direction of the X-axisor the negative direction of the X-axis). For example, the third antennamodule 1330 may be placed between the battery 450 and the side bezelstructure 410, when viewed from the back surface of the electronicdevice 1300. For example, the third antenna module 1330 may be disposedwithin the electronic device 1300 such that a PCB of the third antennamodule 1330 is substantially parallel to the front display or the backplate of the electronic device 1300.

According to various embodiments, the third antenna module 1330 maycorrespond to the antenna module 800 of FIG. 8. According to anembodiment, the third antenna module 1330 may include a plurality ofpatch antenna elements (e.g., the first AE group 840 of FIG. 8) disposedto face the back surface of the electronic device 1300 (e.g., thepositive direction of the Z-axis), when viewing the electronic device1300 from the back surface of the electronic device 1300. The thirdantenna module 1330 may transmit/receive a wireless signal by using abeam having a radiation pattern that is generated around a direction(e.g., the positive direction of the Z-axis) from the interior of theelectronic device 1300 to the outside on one side of the electronicdevice 1300 by using the plurality of patch antenna elements.

According to an embodiment, the third antenna module 1330 may include aplurality of dipole antenna elements and a plurality of shorted patchantenna elements (e.g., the second AE group 845 of FIG. 8). The thirdantenna module 1330 may generate a beam having a radiation patternaround a direction (e.g., the positive direction of the X-axis) from theinterior of the electronic device 1300 to the right of the electronicdevice 1300 and a display direction (e.g., a direction between thepositive X-axis direction and the negative Z-axis direction on the X-Zplane) by using the plurality of dipole antenna elements and theplurality of shorted patch antenna elements. For example, the thirdantenna module 1330 may generate a beam, which is radiated from theinterior of the electronic device 1300 to the outside of the electronicdevice 1300, through the back plate of the electronic device 1300 and anon-conductive region of the side bezel structure 410.

In the embodiment of FIG. 13, the dipole antenna elements of the secondantenna module 1320 and the third antenna module 1330 may be disposed toface a different direction from the dipole antenna elements of the firstantenna module 1310. For example, an upper surface and a side surface ofthe electronic device 1300 may be covered by the dipole antennaelements, and a back surface of the electronic device 1300 may becovered by the patch antenna elements.

FIG. 14 is a cross-sectional view of an interior of an electronic deviceaccording to an embodiment of the disclosure.

Referring to FIG. 14, the cross-sectional view may correspond to across-sectional view observed when a cross section of the electronicdevice 1300 taken along axis A-A′ of FIG. 13 is viewed in a −Y to +Ydirection. According to various embodiments, the third antenna module1330 may be disposed adjacent to the back plate (not illustrated) so asto face the back plate and may be disposed substantially parallel to adisplay (not illustrated).

According to an embodiment, the third antenna module 1330 may include ashield can 1420. The third antenna module 1330 may be disposed on aninterposer 1430 (e.g., a heat radiation structure) that is disposed on aPCB 1440. The interposer 1430 may be used to make a step (e.g., heightdifference) D1−D2 between the third antenna module 1330 and a conductiveregion 1412 of the side bezel structure 410.

According to an embodiment, a component of the electronic device 1300placed on a line of sight of the third antenna module 1330 may be formedof a non-conductive material. The third antenna module 1330 may beplaced to radiate a signal through the back plate and a non-conductiveregion 1411 of the side bezel structure 410. For example, a firstdirection may indicate the line of sight that is able to be generated bythe dipole antenna elements and the shorted antenna elements of thethird antenna module 1330.

According to an embodiment, the non-conductive region 1411 of the sidebezel structure 410 may be produced by a process at least including theinjection-molding process. For example, the non-conductive region 1411may be placed on the conductive region 1412 of the side bezel structure410 through the double injection-molding process.

According to an embodiment, the non-conductive region 1411 of the sidebezel structure 410 may not be viewable from the outside. For example,as the non-conductive region 1411 is covered by the back plate, thenon-conductive region 1411 may not be exposed to the outside.

The configuration of the third antenna module 1330 described withreference to FIG. 14 may be similarly applied to the second antennamodule 1320.

Third Embodiment

Unless otherwise described, the description given with reference to thesecond embodiment above may be applied to the third embodiment.

Returning to FIG. 13, the first antenna module 1310 may correspond tothe antenna module 900 of FIG. 9A or 9B. According to an embodiment, thefirst PCB 951 may include a plurality of patch antenna elements (e.g.,the first AE group 940 of FIG. 9A or 9B) that is substantially parallelto a central portion of a display of the electronic device 1300. Forexample, the first PCB 951 may be disposed such that the plurality ofpatch antenna elements form a beam toward the back surface of theelectronic device 1300.

According to an embodiment, the first antenna module 1310 may include aplurality of dipole antenna elements and a plurality of shorted patchantenna elements (e.g., the second AE group 945 of FIG. 9A or 9B). Forexample, a PCB (e.g., the third PCB 953 of FIG. 9A or 9B) where thereare disposed the dipole antenna elements of the first antenna module1310 may be disposed to be substantially perpendicular to the centralportion of the display of the electronic device 1300. For example, theplurality of dipole antenna elements may be disposed to generate a beamthrough a non-display region of the front surface of the electronicdevice 1300. For example, the plurality of dipole antenna elements maygenerate a beam around the negative direction of the Z-axis.

In this embodiment, as the first antenna module 1310 has a bent shape, amovement of the speaker 1360 may be minimized. Also, the coverage forthe front surface of the electronic device 1300 may be secured by usingthe dipole antenna elements of the first antenna module 1310.

According to an embodiment, the first antenna module 1310 may beimplemented with only the third PCB 953 including the plurality ofdipole antenna elements and the plurality of shorted patch antennas(e.g., the second AE group 945 of FIG. 9A or 9B). For example, the firstantenna module 1310 may not include the first PCB 951 and the second PCB952 of the antenna module 900 of FIG. 9A or 9B. In this case, acommunication circuit may be disposed on a back surface of the third PCB953. The movement of the speaker 1360 may be minimized by verticallydisposing the first antenna module 1310 including only the dipoleantenna elements on an upper portion of the electronic device 1300.

Fourth Embodiment

Unless otherwise described, the description given with reference to thesecond embodiment above may be applied to the fourth embodiment.

Returning to FIG. 13, the first antenna module 1310 may correspond tothe antenna module 900 of FIG. 9A or 9B. According to an embodiment,unlike the example illustrated in FIG. 13, the first antenna module 1310may be disposed to overlap the speaker 1360 on the X-Y plane.

FIG. 15 is a cross-sectional view of an interior of an electronic deviceaccording to an embodiment of the disclosure.

Referring to FIG. 15, the cross-sectional view may correspond to across-sectional view observed when a cross section of the electronicdevice 1300 taken along axis B-B′ of FIG. 13 is viewed in a +X to −Xdirection. According to various embodiments, the first antenna module1310 may include a first PCB 1541 (e.g., the first PCB 951 of FIG. 9A or9B), a second PCB 1542 (e.g., the second PCB 952 of FIG. 9A or 9B), athird PCB 1543 (e.g., the third PCB 953 of FIG. 9A or 9B), a firstshield can 1544, and a second shield can 1545.

For example, the first PCB 1541 may be disposed adjacent to the backplate (not illustrated) so as to face the back plate and may be disposedsubstantially parallel to the display (not illustrated). The first PCB1541 may include a plurality of patch antenna elements (e.g., the firstAE group 940 of FIG. 9A or 9B) disposed to face the back surface of theelectronic device 1300. The first PCB 1541 may be disposed on aninterposer 1520. For example, a heat radiation member 1521 may be placedbetween the interposer 1520 and the first shield can 1544.

For example, the second PCB 1542 may be an FPCB. The second PCB 1542 mayelectrically and/or physically connect the first PCB 1541 and the thirdPCB 1543 over a back surface of the speaker 1360.

For example, the third PCB 1543 may include a plurality of dipoleantenna elements. The third PCB 1543 may be disposed adjacent to theside bezel structure 410 and may be disposed to be substantiallyperpendicular to the display of the electronic device 1300. For example,the plurality of dipole antenna elements of the third PCB 1543 may forma beam through a non-conductive region 1512 of the side bezel structure410. The side bezel structure 410 may include a conductive region 1511on a side of the back plate of the electronic device 1300 and mayinclude the non-conductive region 1512 on a side of the display. Forexample, the plurality of dipole antenna elements of the third PCB 1543may form a beam toward the front surface of the electronic device 1300through the non-conductive region 1512 formed at the first supportmember 411.

In this embodiment, the speaker 1360 may output sound to the outside ofthe electronic device 1300 through a through hole 1540 of the firstsupport member 411 and a receiver hole (e.g., the receiver hole 214 ofFIG. 2) placed on the front surface of the electronic device 1300. Forexample, even though a location of the speaker 1360 is changed due tothe third PCB 1543 thus mounted, a location of the through hole 1540 maybe maintained. That is, an internal location of the speaker 1360 may bechanged without a change of the outer appearance of the electronicdevice 1300 by maintaining the locations of the through hole 1540 andthe receiver hole. For example, the speaker 1360 may be an enclosurespeaker.

Fifth Embodiment

FIG. 16 is a view illustrating antenna modules disposed in an electronicdevice, according to an embodiment of the disclosure.

Referring to FIG. 16, according to an embodiment, an electronic device1600 (e.g., the electronic device 101 of FIG. 1) may include a firstantenna module 1610, a second antenna module 1620, and a third antennamodule 1630. For example, FIG. 16 illustrates an inner appearance of theelectronic device 1600 when viewing the electronic device 1600 from aback surface of the electronic device 1600. For example, FIG. 16 mayillustrate the interior of the electronic device 1600 viewed from theback surface of the electronic device 1600 in one direction (e.g., thenegative direction of the Z-axis), after removing a back plate (e.g.,the back plate 480 of FIG. 4) and an antenna (e.g., the antenna 470 ofFIG. 4) of the electronic device 1600. For another example, FIG. 16 mayillustrate the interior of the electronic device 1600 viewed from theback surface of the electronic device 1600 in the one direction, afterremoving the back plate, the antenna, and a second support member (e.g.,the second support member 460 of FIG. 4) of the electronic device 1600.Unless otherwise described, a structure of the electronic device 1600may be referenced by the description associated with the structure ofthe electronic device 1300 of FIG. 13. In this embodiment, the firstantenna module 1610 may be an antenna module identical to the firstantenna module 1310 of the third embodiment or the fourth embodiment.

According to various embodiments, the second antenna module 1620 may beplaced on the upper left of the back surface of the electronic device1600 in FIG. 16. For example, the second antenna module 1620 may bedisposed at a location where at least a portion of the second antennamodule 1620 overlaps a camera module 1640, when viewed from a sidesurface of the electronic device 1600 (e.g., the positive direction ofthe X-axis or the negative direction of the X-axis). For example, thesecond antenna module 1620 may be placed on the left of the cameramodule 1640 so as to be adjacent to the side bezel structure 410, whenviewed from the back surface of the electronic device 1600.

According to various embodiments, each of the second antenna module 1620and the third antenna module 1630 may correspond to the antenna module900 of FIG. 9A or 9B. According to an embodiment, each of the secondantenna module 1620 and the third antenna module 1630 may include afirst PCB (e.g., the first PCB 951 of FIG. 9A or 9B) including aplurality of patch antenna elements (e.g., the first AE group 940 ofFIG. 9A or 9B), and a third PCB (e.g., the third PCB 953 of FIG. 9A or9B) including a plurality of dipole antenna elements and a plurality ofshorted patch antenna elements. According to an embodiment, the firstPCB and the third PCB may be electrically and physically connectedthrough a second PCB (e.g., the second PCB 952 of FIG. 9A or 9B) havingflexibility. According to an embodiment, the first PCB and the third PCBmay be directly connected, and the second PCB may be implemented with aPCB having flexibility.

According to an embodiment, in each of the second antenna module 1620and the third antenna module 1630, the first PCB may be disposed to facetoward the back surface (e.g., the positive direction of the Z-axis) ofthe electronic device 1600, and the third PCB may be disposed at aregion corresponding to a curved portion (e.g., the second region 210Eof FIG. 3) between the back plate and the side bezel structure 410 ofthe electronic device 1600. For example, as the third PCB is mountedwithin the electronic device 1600 in the shape of being bent from thefirst PCB so as to correspond to the curved portion, a beam generated bythe dipole antenna elements of the third PCB may well face a frontdirection (e.g., the negative direction of the Z-axis) of the electronicdevice 1600.

FIG. 17 is a cross-sectional view of an electronic device according toan embodiment of the disclosure.

Referring to FIG. 17, the cross-sectional view may correspond to across-sectional view observed when a cross section of the electronicdevice 1600 taken along axis A-A′ of FIG. 16 is viewed in a −Y to +Ydirection. According to various embodiments, a patch antenna elementpart 1731 (e.g., a first PCB) of the third antenna module 1630 may bedisposed adjacent to the back plate 480 so as to face the back plate 480and may be disposed substantially parallel to the display 430. Forexample, the back plate 480 may include a back glass 1781 and anon-conductive layer 1782. A dipole and shorted patch antenna elementpart 1732 of the third antenna module 1630 may be disposed adjacent tothe back plate 480 and may be extended from the patch antenna elementpart 1731 along a curved surface of the back plate 480 in a directionfacing the side bezel structure 410. Unless otherwise described, astructure of the third antenna module 1630 may be similar to thestructure of the third antenna module 1330.

According to an embodiment, the third antenna module 1630 may furtherinclude a PCB fill cut region 1733. For example, the PCB fill cut region1733 may be extended toward the side bezel structure 410 from one end ofthe dipole and shorted patch antenna element part 1732 and may be bentalong the curved portion of the back plate 480 when mounted. Forexample, the PCB fill cut region 1733 may indicate one region of a PCB,which does not include a wire structure. The PCB fill cut region 1733may be used to physically fix the third antenna module 1630 to the backplate 480.

According to an embodiment, a step “D” may be present between an antennasurface of the third antenna module 1630 and a conductive region of theside bezel structure 410. For example, like the step D1-D2 describedwith reference to FIG. 14, by setting a height of the conductive regionof the side bezel structure 410 to be relatively lower than a height ofthe antenna surface of the third antenna module 1630, a beam by thethird antenna module 1630 may be further generated toward the frontsurface of the electronic device 1600. As described with reference toFIG. 14, a structure such as an interposer may be used.

Table 1 below illustrates a −90 degree gain for the dipole and shortedpatch antenna element part 1732 according to the step “D” and a gain atthe PCB fill cut region 1733.

TABLE 1 D −90 degree gain Fill cut region gain (mm) (dBi) (dBi) Note −1 −2.4 −1.4 1 4.4 5 3 6.7 7 7 6.9 7.2 N/A 8.5 8.5 side bezel structure 410being formed of non- conductive material

As illustrated in FIG. 17, because the non-conductive layer 1782 iscovered by the back glass 1781 from the outside, an injection-moldingband of the non-conductive layer 1782 is not viewable at the outerappearance of the electronic device 1600.

The configuration of the third antenna module 1630 described withreference to FIG. 17 may be similarly applied to the second antennamodule 1620.

According to various embodiments, an electronic device (e.g., theelectronic device 400 of FIG. 4) may include a display (e.g., thedisplay 430 of FIG. 4) disposed on a front surface of the electronicdevice and a front plate (e.g., the front plate 420 of FIG. 4) disposedon the display, a back plate (e.g., the back plate 480 of FIG. 4) thatis disposed on a back surface of the electronic device, a side member(e.g., the bezel structure 410 of FIG. 4) that is placed between thefront plate and the back plate and forms an outer appearance of theelectronic device together with the front plate and the back plate, andat least one antenna module (e.g., the antenna module 600 of FIG. 6)that includes a plurality of conductive plates (e.g., the first AE group640 and/or the second AE group 645 of FIG. 6) configured totransmit/receive a signal in a specified first frequency band and isdisposed between the front plate and the back plate so as to be adjacentto the side member. For example, at least some of the plurality ofconductive plates may be disposed at the at least one antenna module soas to transmit/receive a wireless signal through the back plate. Forexample, at least some of the plurality of conductive plates may bedisposed at the at least one antenna module so as to transmit/receive awireless signal through a non-conductive region (e.g., thenon-conductive region 1150 of FIG. 11, the non-conductive region 1230 ofFIG. 12, the non-conductive region 1411 of FIG. 14, or thenon-conductive region 1512 of FIG. 15) of the side member. For example,the side member may include a conductive region, of which at least aportion is capable of being used as an antenna of a signal in aspecified second frequency band different from the specified firstfrequency band, and the non-conductive region, and the non-conductiveregion may be covered by the back plate and may not be viewable from theoutside of the electronic device.

According to an embodiment, the at least one antenna module may includea first antenna module (e.g., the first antenna module 1010 of FIG. 10,the first antenna module 1310 of FIG. 13, or the first antenna module1610 of FIG. 16). The first antenna module may be placed on an uppermiddle of the electronic device so as to be adjacent to a speaker (e.g.,the speaker 1060 of FIG. 10, the speaker 1360 of FIG. 13, or a speaker1660 of FIG. 16), and the speaker may output a sound through a receiverhole (e.g., the receiver hole 1540 of FIG. 15) formed on the front plateof the electronic device.

According to an embodiment, the first antenna module (e.g., the firstantenna module 1310 of FIG. 13 or the first antenna module 1610 of FIG.16) may include a printed circuit board (PCB) that is placed between thespeaker and the side member and above the speaker when viewed from theback surface of the electronic device and a printed circuit board (PCB)including a plurality of patch-type conductive plates and a plurality ofdipole-type conductive plates, the plurality of patch-type conductiveplates may be disposed to form a beam toward the back plate, and theplurality of dipole-type conductive plates may be disposed above theplurality of patch-type conductive plates so as to be closer to the sidemember than the plurality of patch-type conductive plates.

According to an embodiment, a location of the plurality of dipole-typeconductive plates may be placed to be higher than the conductive regionof the side member, when viewing the electronic device from a backsurface, such that at least a portion of a beam pattern by the pluralityof dipole-type conductive plates is formed toward the front surface ofthe electronic device.

According to an embodiment, the first antenna module may be placedbetween an interposer (e.g., the interposer 1520 of FIG. 15) disposed ona support member within the electronic device and the back plate, suchthat a location of the plurality of dipole-type conductive plates of thefirst antenna module is higher than the conductive region of the sidemember.

According to an embodiment, the first antenna module (e.g., the antennamodule 900 of FIG. 9A or 9B) may be placed between the speaker and theside member and above the speaker when viewed from the back surface ofthe electronic device. The first antenna module may include a first PCB(e.g., the first PCB 951 of FIG. 9A or 9B) where a plurality ofpatch-type conductive plates are disposed and a second PCB (e.g., thethird PCB 953 of FIG. 9A or 9B) where a plurality of dipole-typeconductive plates are disposed. The first PCB may be placed within theelectronic device such that one surface of the first PCB where theplurality of patch-type conductive plates (e.g., the first AE group 940of FIG. 9A or 9B) are disposed is substantially parallel to the backplate, and the second PCB may be extended from one end of the onesurface of the first PCB toward the side member and may include a curvedportion (e.g., the connection member 952 of FIG. 9A or 9B), of which atleast a portion has a shape of being bent from the one surface of thefirst PCB toward the front surface of the electronic device. Forexample, the curved portion may be a flexible printed circuit board(FPCB) physically and electrically connecting the first PCB and thesecond PCB.

According to an embodiment, the at least one antenna module may includea second antenna module (e.g., the second antenna module 1020 of FIG.10, the second antenna module 1320 of FIG. 13, or the second antennamodule 1620 of FIG. 16) and a third antenna module (e.g., the thirdantenna module 1030 of FIG. 10, the third antenna module 1330 of FIG.13, or the third antenna module 1630 of FIG. 16). The second antennamodule may be placed on an upper left of the electronic device so as tobe adjacent to the side member when viewing the electronic device fromthe back surface of the electronic device. The third antenna module maybe placed on a right side of the electronic device and between a batteryof the electronic device and the side member when viewing the electronicdevice from the back surface of the electronic device.

For example, each of the second antenna module and the third antennamodule may include at least one printed circuit board (PCB) where aplurality of patch-type conductive plates and a plurality of dipole-typeconductive plates are disposed, the plurality of patch-type conductiveplates may be disposed to form a beam toward the back plate, and theplurality of dipole-type conductive plates may be disposed above theplurality of patch-type conductive plates so as to closer to the sidemember than the plurality of patch-type conductive plates.

For example, each of the second antenna module and the third antennamodule may include a first PCB where the plurality of patch-typeconductive plates are disposed and a second PCB where the plurality ofdipole-type conductive plates are disposed, the first PCB may be placedwithin the electronic device such that one surface of the first PCBwhere the plurality of patch-type conductive plates are disposed issubstantially parallel to the back plate, the second PCB may be extendedfrom one end of the one surface of the first PCB toward the side memberand may include a curved portion, of which at least a portion has ashape of being bent from the one surface of the first PCB toward thefront surface of the electronic device, a fill cut region extended froma region, in which the plurality of dipole-type conductive plates aredisposed, toward the side member, and the fill cut region may be formedof a non-conductive material.

According to various embodiments, an electronic device (e.g., theelectronic device 400 of FIG. 4) may include a display (e.g., thedisplay 430 of FIG. 4) disposed on a front surface of the electronicdevice and a front plate (e.g., the front plate 420 of FIG. 4) disposedon the display, a back plate (e.g., the back plate 480 of FIG. 4) thatis disposed on a back surface of the electronic device, a side member(e.g., the bezel structure 410 of FIG. 4) that is placed between thefront plate and the back plate and forms an outer appearance of theelectronic device together with the front plate and the back plate, afirst antenna module (e.g., the first antenna modulel010 of FIG. 10, thefirst antenna module 1310 of FIG. 13 or the first antenna module 1610 ofFIG. 16) that includes a plurality of conductive plates configured totransmit/receive a signal in a first frequency band and is placed on anupper middle of the electronic device so as to be adjacent to a speaker,a second antenna module (e.g., the second antenna module 1020 of FIG.10, the second antenna module 1320 of FIG. 13, or the second antennamodule 1620 of FIG. 16) that includes a plurality of conductive platesconfigured to transmit/receive the signal in the first frequency bandand is placed on an upper left of the electronic device so as to beadjacent to the side member when viewed from the back surface of theelectronic device, and a third antenna module (e.g., the third antennamodule 1030 of FIG. 10, the third antenna module 1330 of FIG. 13, or thethird antenna module 1630 of FIG. 16) that includes a plurality ofconductive plates configured to transmit/receive the signal in the firstfrequency band and is placed on a lower right of the electronic deviceso as to be adjacent to the side member when viewed from the backsurface of the electronic device.

At least some of the plurality of conductive plates of the secondantenna module may be disposed at the second antenna module so as totransmit/receive a wireless signal through the back plate andtransmit/receive a wireless signal through a non-conductive region ofthe side member, and at least some of the plurality of conductive platesof the third antenna module may be disposed at the third antenna moduleso as to transmit/receive a wireless signal through the back plate andtransmit/receive a wireless signal through a non-conductive region ofthe side member. The side member may include a conductive region, ofwhich at least a portion is capable of being used as an antenna of asignal in a specified second frequency band different from the specifiedfirst frequency band, and the non-conductive region, and the speaker mayoutput a sound through a receiver hole formed at the front plate of theelectronic device.

According to an embodiment, the non-conductive region may be covered bythe back plate and may not be viewable from the outside of theelectronic device.

According to an embodiment, the first antenna module may be placedbetween the speaker and the side member and above the speaker whenviewed from the back surface of the electronic device and may include aPCB including a plurality of patch-type conductive plates and aplurality of dipole-type conductive plates. For example, the pluralityof patch-type conductive plates may be disposed to form a beam towardthe back plate, and the plurality of dipole-type conductive plates maybe disposed above the plurality of patch-type conductive plates so as tobe closer to the side member than the plurality of patch-type conductiveplates.

For example, a location of the plurality of dipole-type conductiveplates may be placed to be higher than the conductive region of the sidemember, when viewing the electronic device from the back surface, suchthat at least a portion of a beam pattern by the plurality ofdipole-type conductive plates is formed toward the front surface of theelectronic device.

For example, the first antenna module may be placed between aninterposer disposed on a support member within the electronic device andthe back plate, such that a location of the plurality of dipole-typeconductive plates of the first antenna module is higher than theconductive region of the side member.

For example, the first antenna module may include a first PCB that isplaced below the speaker when viewing the electronic device from theback surface of the electronic device, and on which a plurality ofpatch-type conductive plates are disposed, a third PCB that is placedbetween the speaker and the side member and above the speaker whenviewed from above the back surface of the electronic device and on whicha plurality of dipole-type conductive plates are disposed, and a secondPCB that physically connects one end of the first PCB and one end of thethird PCB over the speaker and electrically connects the first PCB andthe third PCB. The first PCB may be placed within the electronic devicesuch that one surface of the first PCB, on which the plurality ofpatch-type conductive plates are disposed, is substantially parallel tothe back plate. The third PCB may be extended from the one end connectedwith the second PCB toward the front surface of the electronic deviceand may be placed within the electronic device so as to be substantiallyperpendicular to the back plate.

For example, the plurality of dipole-type conductive plates disposed atthe third PCB may be disposed to form a beam toward the front surface ofthe electronic device from the one end of the third PCB, which isconnected with the second PCB. At least some beams by the dipole-typeconductive plates may be formed toward the front surface of theelectronic device through a remaining region of the front plate of theelectronic device other than the display.

According to an embodiment, the second antenna module may be placedbetween a camera module of the electronic device and the side member soas to be adjacent to the side member, when viewing the electronic devicefrom the back surface of the electronic device, and the third antennamodule may be placed on a right side of the electronic device andbetween a battery of the electronic device and the side member, whenviewing the electronic device from the back surface of the electronicdevice.

For example, each of the second antenna module and the third antennamodule may include at least one PCB where a plurality of patch-typeconductive plates and a plurality of dipole-type conductive plates aredisposed. The plurality of patch-type conductive plates may be disposedto form a beam toward the back plate, and the plurality of dipole-typeconductive plates may be disposed above the plurality of patch-typeconductive plates so as to be closer to the side member than theplurality of patch-type conductive plates.

For example, each of the second antenna module and the third antennamodule may include a first PCB where the plurality of patch-typeconductive plates are disposed and a second PCB where the plurality ofdipole-type conductive plates are disposed. The first PCB may be placedwithin the electronic device such that one surface of the first PCBwhere the plurality of patch-type conductive plates are disposed issubstantially parallel to the back plate, and the second PCB may beextended from one end of the one surface of the first PCB toward theside member and may include a curved portion, of which at least aportion has a shape of being bent from the one surface of the first PCBtoward the front surface of the electronic device, and a fill cut regionextended from a region, in which the plurality of dipole-type conductiveplates are disposed, toward the side member. The fill cut region may beformed of a non-conductive material.

According to embodiments of the disclosure, an electronic device mayprovide a null point free coverage by using a plurality of antennamodules disposed to have an optimized coverage.

According to embodiments of the disclosure, the electronic device mayinclude an antenna module disposed to minimize an interference withanother antenna and may thus support legacy mobile communication and 5Gmobile communication at the same time.

Besides, a variety of effects directly or indirectly understood throughthis disclosure may be provided.

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a displaydisposed on a front surface of the electronic device and a front platedisposed on the display; a back plate disposed on a back surface of theelectronic device; a side member placed between the front plate and theback plate and forming an outer appearance of the electronic devicetogether with the front plate and the back plate; a first antenna moduleincluding a plurality of first patch antenna elements and a plurality offirst dipole antenna elements configured to transmit/receive a signal ina first frequency band, and placed adjacent to the side member and on anupper portion of the electronic device such that the plurality of firstpatch antenna elements face the back plate; a second antenna moduleincluding a plurality of second patch antenna elements configured totransmit/receive the signal in the first frequency band, and placedadjacent to the side member such that the plurality of second patchantenna elements face a left side of the electronic device when viewingthe electronic device from the back surface; and a third antenna moduleincluding a plurality of third patch antenna elements configured totransmit/receive the signal in the first frequency band, and placedadjacent to the side member such that the plurality of third patchantenna elements face a right side of the electronic device when viewingthe electronic device from the back surface.
 2. The electronic device ofclaim 1, further comprising: a speaker placed on an upper middle of theelectronic device, and configured to output a sound through a receiverhole formed on the front plate of the electronic device, wherein thefirst antenna module is placed on a right side of the speaker whenviewing the electronic device from the back surface.
 3. The electronicdevice of claim 2, wherein the plurality of first patch antenna elementsare disposed to face the back plate such that a wireless signal istransmitted/received through the back plate, wherein the plurality offirst dipole antenna elements are disposed to transmit/receive awireless signal through the back plate and a non-conductive region ofthe side member, wherein the side member includes a conductive region,of which at least a portion is capable of being used as an antenna of asignal in a second frequency band different from the first frequencyband, and the non-conductive region, and wherein the non-conductiveregion is covered by the back plate and is not viewable from the outsideof the electronic device.
 4. The electronic device of claim 3, whereinthe plurality of first dipole antenna elements are placed to be higherthan the conductive region of the side member adjacent to the firstantenna module when viewing the electronic device from the back surface,such that at least a portion of a beam pattern by the plurality of firstdipole antenna elements is formed toward the front surface of theelectronic device.
 5. The electronic device of claim 4, wherein thefirst antenna module is placed between an interposer disposed on asupport member within the electronic device and the back plate.
 6. Theelectronic device of claim 4, further comprising: a connection memberelectrically connecting the conductive region of the side memberadjacent to the first antenna module with a ground region placed withinthe electronic device, wherein the connection member is placed betweenthe first antenna module and the side member and above the first antennamodule, and wherein a contact of the connection member and the sidemember is formed at a location lower than the first antenna module whenviewing the electronic device from the back surface.
 7. The electronicdevice of claim 2, wherein the first antenna module includes a printedcircuit board including a first surface having a long axis and a shortaxis and a second surface facing away from the first surface, whereinthe plurality of first patch antenna elements are disposed on the firstsurface along a direction of the long axis, wherein the plurality offirst dipole antenna elements are disposed in a fill cut region of theprinted circuit board along the direction of the long axis, and whereinthe fill cut region is formed of a non-conductive material.
 8. Theelectronic device of claim 2, wherein the first antenna module isdisposed such that at least a portion of the first antenna moduleoverlaps the speaker when viewed from the right side or the left side ofthe electronic device.
 9. The electronic device of claim 1, wherein thesecond antenna module is mounted in the electronic device such that theplurality of second patch antenna elements are substantiallyperpendicular to the back plate and is placed adjacent to the sidemember and on an upper left of the electronic device when viewing theelectronic device from the back surface.
 10. The electronic device ofclaim 9, wherein the plurality of second patch antenna elements aredisposed to transmit/receive a wireless signal through the back plateand a non-conductive region of the side member, wherein the side memberincludes a conductive region, of which at least a portion is capable ofbeing used as an antenna of a signal in a second frequency banddifferent from the first frequency band, and the non-conductive region,and wherein the non-conductive region is covered by the back plate andis not viewable from the outside of the electronic device.
 11. Theelectronic device of claim 10, further comprising: a connection memberelectrically connecting the conductive region of the side memberadjacent to the second antenna module with a ground region placed withinthe electronic device, wherein the connection member is placed on aright side of the second antenna module when viewing the electronicdevice from the back surface, and wherein a contact of the connectionmember and the side member is formed on the right side of the secondantenna module when viewing the electronic device from the back surface.12. The electronic device of claim 1, wherein the third antenna moduleis mounted in the electronic device such that the plurality of thirdpatch antenna elements are substantially perpendicular to the back plateand is placed at the right side of the electronic device and between abattery of the electronic device and the side member when viewing theelectronic device from the back surface.
 13. The electronic device ofclaim 12, wherein the plurality of third patch antenna elements aredisposed to transmit/receive a wireless signal through the back plateand a non-conductive region of the side member, wherein the side memberincludes a conductive region, of which at least a portion is capable ofbeing used as an antenna of a signal in a second frequency banddifferent from the first frequency band, and the non-conductive region,and wherein the non-conductive region is covered by the back plate andis not viewable from the outside of the electronic device.
 14. Theelectronic device of claim 13, further comprising: contacts electricallyconnecting an upper portion and a lower portion of the conductive regionof the side member adjacent to the third antenna module with a groundregion placed within the electronic device, when viewed from the backsurface of the electronic device.
 15. An electronic device comprising: adisplay disposed on a front surface of the electronic device and a frontplate disposed on the display; a back plate disposed on a back surfaceof the electronic device; a side member placed between the front plateand the back plate and forming an outer appearance of the electronicdevice together with the front plate and the back plate; a first antennamodule including a plurality of first patch antenna elements and aplurality of first dipole antenna elements configured totransmit/receive a signal in a first frequency band, and placed adjacentto a speaker placed on an upper middle of the electronic device whenviewed from the back surface of the electronic device; a second antennamodule including a plurality of second patch antenna elements configuredto transmit/receive the signal in the first frequency band, and placedadjacent to the side member and on an upper left of the electronicdevice when viewed from the back surface of the electronic device; and athird antenna module including a plurality of third patch antennaelements configured to transmit/receive the signal in the firstfrequency band, and placed on a lower right of the electronic device andbetween a battery and the side member when viewing the electronic devicefrom the back surface, wherein the plurality of second patch antennaelements are disposed to transmit/receive a wireless signal toward aleft side of the electronic device when viewing the electronic devicefrom the back surface, and wherein the plurality of third patch antennaelements are disposed to transmit/receive a wireless signal toward aright side of the electronic device when viewing the electronic devicefrom the back surface.
 16. The electronic device of claim 15, whereinthe side member includes a conductive region, which is used as anantenna of a wireless signal in a second frequency band different fromthe first frequency band, and a non-conductive region, and wherein thenon-conductive region is covered by the back plate and is not viewablefrom the outside of the electronic device.
 17. The electronic device ofclaim 16, wherein the conductive region of the side member is adjacentto the first antenna module and is relatively lower than the firstantenna module, when viewing the electronic device from the backsurface, such that at least a portion of a beam pattern by the pluralityof first dipole antenna elements is formed toward the front surface ofthe electronic device.
 18. The electronic device of claim 15, whereinthe plurality of first patch antenna elements are disposed totransmit/receive a wireless signal through the back plate, wherein theplurality of first dipole antenna elements are disposed totransmit/receive a wireless signal through the back plate and anon-conductive region of the side member, wherein the plurality ofsecond patch antenna elements are disposed to transmit/receive awireless signal through the non-conductive region of the side member andthe back plate, and wherein the plurality of third patch antennaelements are disposed to transmit/receive a wireless signal through thenon-conductive region of the side member and the back plate.
 19. Theelectronic device of claim 18, wherein the first antenna module isplaced between an interposer disposed on a support member within theelectronic device and the back plate.
 20. The electronic device of claim18, wherein contacts electrically connecting the side member with aground in the electronic device are placed at a conductive region of theside member adjacent to the first antenna module, a conductive region ofthe side member adjacent to the second antenna module, and a conductiveregion of the side member adjacent to the third antenna module.